다중 물리학 시뮬레이션 기법을 이용한 해양 대기 환경에서의 인쇄 회로 기판 부식 수명 예측

Abstract

Printed Circuit Board (PCB), a major component of precision electronics, has been used in a variety of extreme environments such as the data center near the coast. In this work, a Multiphysics simulation for predicting the corrosion lifetime of PCB in a marine atmosphere environment considering the various designs was developed. The prediction method of PCB corrosionwas developed by using the electrochemistry model of software COMSOL [1]. The simulation model was developed to evaluate the time to failure (TTF) of the PCB, considering geometry factors (copper trace width, spacing, and via hole pad diameter) and environmental factor (NaCl concentration). An acceleration test using salt spray chamber was developed to verify the simulation result. The TTF of the PCB specimen was measured by monitoring the voltage and current of the circuit, and it was compared with the simulation results. Finally, the corrosion life equations of the PCBs depending on geometrical and environmental factors were derived through simulations and experiments.