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Structural, chemical, and electrical properties of Y2O3 thin films grown by atomic layer deposition with an (iPrCp)(2)Y(iPr-amd) precursor

Authors
Kang, JiehunJung, Yong ChanSeong, SejongLee, TaehoonAhn, JinhoNoh, WontaePark, In-Sung
Issue Date
Jun-2017
Publisher
ELSEVIER SCI LTD
Keywords
Y2O3 film; Atomic layer deposition; (iPrCp)(2)Y(iPr-amd); XPS; Leakage current
Citation
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, v.63, pp.279 - 284
Indexed
SCIE
SCOPUS
Journal Title
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume
63
Start Page
279
End Page
284
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/19694
DOI
10.1016/j.mssp.2017.02.031
ISSN
1369-8001
Abstract
Y2O3 thin films were grown by atomic layer deposition (ALD) through a heteroleptic liquid (iPrCp)2Y(iPr-amd) precursor at 350 °C. The structural and chemical properties of both as-deposited and annealed Y2O3 films at 500 °C and 700 °C are analyzed by atomic force microscopy for variation in surface roughness, X-ray diffraction for crystalline structure, and X-ray photoelectron spectroscopy for chemical states. The as-deposited Y2O3 film shows the same crystalline orientation along the plane (222), a stoichiometric state, and minimal hydroxylate formation up to 700 °C. Being the dielectric layer in the metal-oxide-semiconductor capacitor, the as-deposited ALD-Y2O3 films with liquid (iPrCp)2Y(iPr-amd) precursor without any post-deposition annealing show the much lower leakage density than ALD-Y2O3 with solid Y(MeCp)3.
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