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Investigation of adhesion at LPCVD and PECVD silicon nitride/copper film interface by laser spallation technique
- Authors
- 이승환
- Issue Date
- 27-Jun-2024
- Place
- 제주 서귀포 KAL호텔
- Conference Name
- 대한기계학회 재료 및 파괴부문 2024년 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)