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Monolithic 3D Integration Process and Its Device Applications
- Authors
- Choi, Chang hwan
- Issue Date
- Mar-2022
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- Ion Implantation; Monolithic 3D Integration (M3D); Wafer Bonding
- Citation
- 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022, pp 76 - 78
- Pages
- 3
- Indexed
- SCOPUS
- Journal Title
- 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022
- Start Page
- 76
- End Page
- 78
- Abstract
- We have demonstrated the monolithic 3D integration (M3D) process and its applications to hybrid CMOS and photodiode device system as well as 3D neuromorphic device system. This M3D process was realized by both hydrogen ion (H+) implantation and Silicon-on-Insulator (SOI) wafer bonding with optimized various unit processes. Our result indicate that M3D integration process can be an alternative process integration scheme to the conventional 2D scaling process.
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)