Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes
DC Field | Value | Language |
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dc.contributor.author | Yu, Myeong-Hyeon | - |
dc.contributor.author | Joo, Sung-Jun | - |
dc.contributor.author | Kim, Hak-Sung | - |
dc.date.accessioned | 2021-08-02T15:28:05Z | - |
dc.date.available | 2021-08-02T15:28:05Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2017-05 | - |
dc.identifier.issn | 0957-4484 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/20360 | - |
dc.description.abstract | In this work, bimodal Cu nano-inks composed of two different sizes of Cu nanoparticles (NPs) (40 and 100 nm in diameter) were successfully sintered with a multi-pulse flashlight sintering technique. Bimodal Cu nano-inks were fabricated and printed with various mixing ratios and subsequently sintered by a flash light sintering method. The effects of the flashlight sintering conditions, including irradiation energy and pulse number, were investigated to optimize the sintering conditions. A detailed mechanism of the sintering of bimodal Cu nano-ink was also studied via real-time resistance measurement during the sintering process. The sintered Cu nano-ink films were characterized using x-ray photoelectron spectroscopy and scanning electron microscopy. From these results, it was found that the optimal ratio of 40-100 nm NPs was found to be 25:75 wt%, and the optimal multi-pulse flash light sintering condition (irradiation energy: 6 J cm(-2), and pulse duration: 1 ms, off-time: 4 ms, and pulse number: 5) was found. The optimally sintered Cu nano-ink film exhibited the lowest resistivity of 5.68 mu Omega cm and 5B adhesion level. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Hak-Sung | - |
dc.identifier.doi | 10.1088/1361-6528/aa6cda | - |
dc.identifier.scopusid | 2-s2.0-85019004103 | - |
dc.identifier.wosid | 000406029600002 | - |
dc.identifier.bibliographicCitation | NANOTECHNOLOGY, v.28, no.20, pp.1 - 11 | - |
dc.relation.isPartOf | NANOTECHNOLOGY | - |
dc.citation.title | NANOTECHNOLOGY | - |
dc.citation.volume | 28 | - |
dc.citation.number | 20 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 11 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | INTENSE PULSED-LIGHT | - |
dc.subject.keywordPlus | COPPER NANO-INK | - |
dc.subject.keywordPlus | FLEXIBLE SUBSTRATE | - |
dc.subject.keywordPlus | ELECTRICAL-CONDUCTIVITY | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | LASER | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordPlus | PARTICLES | - |
dc.subject.keywordPlus | DENSITY | - |
dc.subject.keywordAuthor | printed electronics | - |
dc.subject.keywordAuthor | bimodal Cu nanoparticles | - |
dc.subject.keywordAuthor | flash light sintering | - |
dc.subject.keywordAuthor | multi-pulse sintering | - |
dc.subject.keywordAuthor | adhesion strength and resistivity | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1088/1361-6528/aa6cda | - |
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