Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes
- Authors
- Yu, Myeong-Hyeon; Joo, Sung-Jun; Kim, Hak-Sung
- Issue Date
- May-2017
- Publisher
- IOP PUBLISHING LTD
- Keywords
- printed electronics; bimodal Cu nanoparticles; flash light sintering; multi-pulse sintering; adhesion strength and resistivity
- Citation
- NANOTECHNOLOGY, v.28, no.20, pp.1 - 11
- Indexed
- SCIE
SCOPUS
- Journal Title
- NANOTECHNOLOGY
- Volume
- 28
- Number
- 20
- Start Page
- 1
- End Page
- 11
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/20360
- DOI
- 10.1088/1361-6528/aa6cda
- ISSN
- 0957-4484
- Abstract
- In this work, bimodal Cu nano-inks composed of two different sizes of Cu nanoparticles (NPs) (40 and 100 nm in diameter) were successfully sintered with a multi-pulse flashlight sintering technique. Bimodal Cu nano-inks were fabricated and printed with various mixing ratios and subsequently sintered by a flash light sintering method. The effects of the flashlight sintering conditions, including irradiation energy and pulse number, were investigated to optimize the sintering conditions. A detailed mechanism of the sintering of bimodal Cu nano-ink was also studied via real-time resistance measurement during the sintering process. The sintered Cu nano-ink films were characterized using x-ray photoelectron spectroscopy and scanning electron microscopy. From these results, it was found that the optimal ratio of 40-100 nm NPs was found to be 25:75 wt%, and the optimal multi-pulse flash light sintering condition (irradiation energy: 6 J cm(-2), and pulse duration: 1 ms, off-time: 4 ms, and pulse number: 5) was found. The optimally sintered Cu nano-ink film exhibited the lowest resistivity of 5.68 mu Omega cm and 5B adhesion level.
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