High-Temperature Stable Amorphous Sn-Rich InSnGaO Thin Films Fabricated Via Atomic Layer Deposition for Next-Generation Dynamic Random-Access Memory Applications
- Authors
- Ryu, Seong-Hwan; Kim, Hye-Mi; Lee, Kwang-Hee; Sung, Ha-Jun; Yang, Jee-Eun; Kim, Sangwook; Park, Jin-Seong
- Issue Date
- Dec-2024
- Publisher
- American Chemical Society
- Keywords
- atomic layer deposition; oxide semiconductor; amorphous indium tin gallium oxide; high-temperature stability; field-effect transistor
- Citation
- Nano Letters, v.24, no.50, pp 16039 - 16046
- Pages
- 8
- Indexed
- SCIE
SCOPUS
- Journal Title
- Nano Letters
- Volume
- 24
- Number
- 50
- Start Page
- 16039
- End Page
- 16046
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/204359
- DOI
- 10.1021/acs.nanolett.4c04499
- ISSN
- 1530-6984
1530-6992
- Abstract
- Facile phase transitions and electrical degradation of amorphous oxide semiconductors due to a high thermal budget have significantly limited their dynamic random-access memory (DRAM) applications, which require high thermal stability at temperatures over 600 degrees C. In this paper, we report an amorphous In-Sn-Ga-O (ITGO) semiconductor fabricated via atomic layer deposition, which exhibits high-temperature (similar to 700 degrees C) phase stability with moderate electrical properties. The optimal Sn-rich ITGO composition (In/Sn/Ga = 25:58:17 at. %) represents a thermally stable amorphous phase with excellent Hall mobility (24.0 cm2/(V s)) above 600 degrees C. Various analytical and simulation methods reveal the role of Sn as an efficient amorphous stabilizer and enhancer of electron mobility in oxide semiconductors. A thin-film transistor with a 4.5 nm-thick ITGO channel demonstrates excellent field-effect mobility (7.7 cm2/(V s)) and reliability. Therefore, Sn-rich ITGO is a promising candidate for next-generation DRAM channels that require amorphous-phase stability at a high thermal budget.
Facile phase transitions and electrical degradation of amorphous oxide semiconductors due to a high thermal budget have significantly limited their dynamic random-access memory (DRAM) applications, which require high thermal stability at temperatures over 600 °C. In this paper, we report an amorphous In−Sn−Ga−O (ITGO) semiconductor fabricated via atomic layer deposition, which exhibits high-temperature (∼700 °C) phase stability with moderate electrical properties. The optimal Sn-rich ITGO composition (In/Sn/Ga = 25:58:17 at. %) represents a thermally stable amorphous phase with excellent Hall mobility (24.0 cm2 /(V s)) above 600 °C. Various analytical and simulation methods reveal the role of Sn as an efficient amorphous stabilizer and enhancer of electron mobility in oxide semiconductors. A thin-film transistor with a 4.5 nm-thick ITGO channel demonstrates excellent field-effect mobility (7.7 cm2 /(V s)) and reliability. Therefore, Sn-rich ITGO is a promising candidate for next-generation DRAM channels that require amorphous-phase stability at a high thermal budget.
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