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High-Temperature Stable Amorphous Sn-Rich InSnGaO Thin Films Fabricated Via Atomic Layer Deposition for Next-Generation Dynamic Random-Access Memory Applications

Authors
Ryu, Seong-HwanKim, Hye-MiLee, Kwang-HeeSung, Ha-JunYang, Jee-EunKim, SangwookPark, Jin-Seong
Issue Date
Dec-2024
Publisher
American Chemical Society
Keywords
atomic layer deposition; oxide semiconductor; amorphous indium tin gallium oxide; high-temperature stability; field-effect transistor
Citation
Nano Letters, v.24, no.50, pp 16039 - 16046
Pages
8
Indexed
SCIE
SCOPUS
Journal Title
Nano Letters
Volume
24
Number
50
Start Page
16039
End Page
16046
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/204359
DOI
10.1021/acs.nanolett.4c04499
ISSN
1530-6984
1530-6992
Abstract
Facile phase transitions and electrical degradation of amorphous oxide semiconductors due to a high thermal budget have significantly limited their dynamic random-access memory (DRAM) applications, which require high thermal stability at temperatures over 600 degrees C. In this paper, we report an amorphous In-Sn-Ga-O (ITGO) semiconductor fabricated via atomic layer deposition, which exhibits high-temperature (similar to 700 degrees C) phase stability with moderate electrical properties. The optimal Sn-rich ITGO composition (In/Sn/Ga = 25:58:17 at. %) represents a thermally stable amorphous phase with excellent Hall mobility (24.0 cm2/(V s)) above 600 degrees C. Various analytical and simulation methods reveal the role of Sn as an efficient amorphous stabilizer and enhancer of electron mobility in oxide semiconductors. A thin-film transistor with a 4.5 nm-thick ITGO channel demonstrates excellent field-effect mobility (7.7 cm2/(V s)) and reliability. Therefore, Sn-rich ITGO is a promising candidate for next-generation DRAM channels that require amorphous-phase stability at a high thermal budget.
Facile phase transitions and electrical degradation of amorphous oxide semiconductors due to a high thermal budget have significantly limited their dynamic random-access memory (DRAM) applications, which require high thermal stability at temperatures over 600 °C. In this paper, we report an amorphous In−Sn−Ga−O (ITGO) semiconductor fabricated via atomic layer deposition, which exhibits high-temperature (∼700 °C) phase stability with moderate electrical properties. The optimal Sn-rich ITGO composition (In/Sn/Ga = 25:58:17 at. %) represents a thermally stable amorphous phase with excellent Hall mobility (24.0 cm2 /(V s)) above 600 °C. Various analytical and simulation methods reveal the role of Sn as an efficient amorphous stabilizer and enhancer of electron mobility in oxide semiconductors. A thin-film transistor with a 4.5 nm-thick ITGO channel demonstrates excellent field-effect mobility (7.7 cm2 /(V s)) and reliability. Therefore, Sn-rich ITGO is a promising candidate for next-generation DRAM channels that require amorphous-phase stability at a high thermal budget.
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