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Development of Multiple Redistribution Layer (RDL) Using FEOL photolithography Toward 2.xD Packaging Technology
- Authors
- 최창환
- Issue Date
- 18-Jan-2024
- Place
- 대전컨벤션센터
- Conference Name
- NANO CONVERGENCE CONFERENCE(NCC) 2024
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)