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In-situ non-destructive inspection technique for analyzing chip alignment and warpage in semiconductor packages using terahertz waves
- Authors
- 김학성
- Issue Date
- 8-Nov-2024
- Conference Name
- ISMP2024
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)