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비파괴검사 데이터의 머신러닝을 이용한 재료강도 추정 및 반도체 패키징 공정 모니터링 가술개말
- Authors
- 김학성
- Issue Date
- 30-Oct-2024
- Conference Name
- 추계비파괴검사학회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)