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전사 인쇄를 활용한 다종의 박막 반도체 이종 집적 3D IC 기술
- Authors
- 정예환
- Issue Date
- 3-Apr-2024
- Place
- 국립아립
- Conference Name
- KMEPS 2024년 정기학술대회
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Jung, Yei Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)