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Laser Spallation Test를 활용한 LPCVD 및 PECVD로 증착된 Silicon Nitride와 Copper 박막간 계면 접착 강도 평가
- Authors
- 이승환
- Issue Date
- 14-May-2025
- Place
- 제주 신화월드
- Conference Name
- 2025 한국정밀공학회 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)