Challenges of Atomic-Layer-Deposited Oxide Semiconductor Channels beyond PVD: Material, Devices, and M3D Stacked Structures
- Authors
- Kim, Yoon-Seo; Choi, Su-Hwan; Oh, Hyejin; Hwang, Taewon; Park, Jin-Seong
- Issue Date
- Jun-2025
- Keywords
- Atomic Layer Deposition; High field-effect mobility IGZO; Monolithic Stacked Complementary FET; Nitrogen doping; Oxide Semiconductor; ptype SnO; Thin Film Transistor
- Citation
- Digest of Technical Papers - SID International Symposium, v.56, no.1, pp 946 - 949
- Pages
- 4
- Indexed
- SCOPUS
- Journal Title
- Digest of Technical Papers - SID International Symposium
- Volume
- 56
- Number
- 1
- Start Page
- 946
- End Page
- 949
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/209213
- DOI
- 10.1002/sdtp.18327
- ISSN
- 0097-966X
2168-0159
- Abstract
- This study explores ALD-based oxide semiconductors, highlighting in-situ composition control, atomic-scale ordering, and interface engineering. High-mobility (>100 cm²/V·s) IGZO and stable p-type SnO (<5 cm²/V·s) devices are achieved via optimized ALD processes. We demonstrate monolithic 3D- stacked complementary transistors and propose N₂O plasma for addressing mobility-stability trade-offs. ALD's pivotal role in scalable, high-performance active-matrix device fabrication is emphasized, showcasing its potential for mass production.
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