Facile control of p-type SnO TFT performance with restraining redox reaction by ITO interlayersopen access
- Authors
- Choi, Su-Hwan; Kim, Hye-Mi; Park, Jin Seong
- Issue Date
- Apr-2023
- Publisher
- TAYLOR & FRANCIS LTD
- Keywords
- Atomic layer deposition (ALD); tin monoxide (SnO); thin-film transistors; source; drain modulation; off-current reduction
- Citation
- JOURNAL OF INFORMATION DISPLAY, v.24, no.2, pp 119 - 125
- Pages
- 7
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- JOURNAL OF INFORMATION DISPLAY
- Volume
- 24
- Number
- 2
- Start Page
- 119
- End Page
- 125
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/209284
- DOI
- 10.1080/15980316.2022.2151522
- ISSN
- 1598-0316
2158-1606
- Abstract
- By comparing Ni and ITO electrodes of SnO TFT, we find a facile method to control p-type SnO TFT performance. A Ni-electrode TFT has a high field-effect mobility of 3.3 cm2/Vs and a low on/off current ratio of 3.6 × 101. Compared to Ni, ITO-electrode TFT has low field-effect mobility of 1.4 cm2/Vs and a high on/off current ratio of 1.1 × 103. Using various analysis methods, we suggested why the electrical properties of SnO TFT differed depending on the electrode materials. First, a redox reaction occurs at the interface of SnO and Ni during the post-annealing process. Second, Ni has an ohmic-like contact formation with SnO, which lowers the Schottky barrier height of carriers. ITO ILs are adopted to Ni electrode to reduce the off-current by hindering the redox reaction. The off-current of TFTs is effectively reduced with ITO ILs as thickness increases. An ITO IL that is 10-nm thick yields the optimum electrical properties: field-effect mobility of 2.5 cm2/Vs, Ion/Ioff of 1.7 × 103 and Vth shift under NBS of −1.4 V.
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