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Nonlinear quantized conductance dynamics in vertical SiN RRAM for scalable memory-learning integration

Authors
Park, JiheeKim, NawoonNa, HyesungKim, HyungjinKim, Sungjun
Issue Date
Sep-2026
Publisher
ELSEVIE
Keywords
Vertical rram; Conductance quantization; Multi-bit memory; Neuromorphic computing; Synaptic plasticity
Citation
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.266, pp 76 - 91
Pages
16
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume
266
Start Page
76
End Page
91
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/211536
DOI
10.1016/j.jmst.2025.11.034
ISSN
1005-0302
1941-1162
Abstract
We report a vertical resistive random-access memory device based on a Pt/SiN/Ti stack, designed for multi-bit storage and neuromorphic computing. The device exhibits stable bipolar switching and achieves up to 7-bit (128-level) conductance states through precise control of compliance current and reset voltage. Quantized conductance plateaus, corresponding to integer and half-integer multiples of the quantum conductance G<inf>0</inf> = 2e2/h, reveal atomic-scale filament dynamics governed by nonlinear conduction processes. Diverse synaptic plasticity functions, including spike-number-, spike-rate-, spike-duration-, and spike-amplitude-dependent plasticity, were experimentally emulated. Neuromorphic simulations for the Modified National Institute of Standards and Technology dataset achieved classification accuracies exceeding 94 %, confirming the device's suitability for high-precision weight modulation. The vertical architecture ensures scalability toward three-dimensional integration, while robust retention and compatibility with current-based multi-bit modulation highlight its potential for complex-system-inspired edge AI and in-memory computing hardware.
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