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An ultra-thin InO interlayer as an oxygen reservoir for defect passivation and enhanced ferroelectricity in hafnia devices

Authors
Hwang, JunghyeonKim, ChaeheonAhn, JinhoJeon, Sanghun
Issue Date
Dec-2025
Publisher
ROYAL SOC CHEMISTRY
Citation
JOURNAL OF MATERIALS CHEMISTRY C, v.13, no.48, pp 23819 - 23830
Pages
12
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF MATERIALS CHEMISTRY C
Volume
13
Number
48
Start Page
23819
End Page
23830
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/212122
DOI
10.1039/d5tc02606g
ISSN
2050-7526
2050-7534
Abstract
We report an interface engineering approach to enhance the ferroelectric properties and reliability of ultra-thin hafnium zirconium oxide (HZO) capacitors by introducing an indium oxide (InO) interlayer. Acting as an oxygen reservoir, the InO interlayer mitigates interface-driven degradation by replenishing oxygen vacancies at the HZO-electrode interface during thermal processing, thereby suppressing sub-oxide formation and improving interfacial stability. The TiN/InO/HZO/TiN metal-ferroelectric-metal (MFM) stack demonstrates up to a 35% increase in remanent polarization (Pr) and approximately one-order reduction in leakage current in representative devices compared to control devices without InO. Spectroscopic analyses, including X-ray photoelectron spectroscopy (XPS) and electron energy loss spectroscopy (EELS), confirm a significant reduction in sub-oxide fractions, validating the oxygen-supplying role of InO. Furthermore, transient current analysis and the conductance method reveal that the InO interlayer effectively passivates interfacial "dead layers," enhancing interfacial capacitance and charge transport. Nucleation-limited switching (NLS) analysis indicates improved domain switching kinetics with a more uniform switching time distribution. Endurance and retention tests demonstrate robust reliability, sustaining over 108 switching cycles and stable polarization retention for more than a decade. These findings provide critical insights into oxygen-mediated defect passivation in ferroelectric hafnia-based devices and offer a scalable strategy for advanced memory and logic applications.
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