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A Modified Test Vehicle Incorporating Distance from Neutral Point (DNP)-Induced Strain Gradients for Single-Specimen Fatigue Life Assessment of Solder Joints

Authors
김학성
Issue Date
5-Dec-2025
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/214741
Place
Resorts World Sentosa, Singapore
Conference Name
Ellectronics Packaging Technology Conference
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서울 공과대학 > 서울 기계공학부 > 2. Conference Papers

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Kim, Hak Sung
COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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