Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Advanced Flip-chip Bonding Process via Intense Pulsed Light Irradiation: From Single-Chip to Multi-Chip Stacking Applications
- Authors
- 김학성
- Issue Date
- 11-Nov-2025
- Place
- 파라다이스호텔, 부산
- Conference Name
- The 4th Korean International Semiconductor Conference & Exhibition on Manufacturing Technology
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)