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Study on RDL reliability in advanced semiconductor packaging through copper migration analysis and current density optimization
- Authors
- 김학성
- Issue Date
- 25-Jun-2025
- Place
- 서귀포 칼호텔, 제주
- Conference Name
- 대한기계학회 재료 및 파괴부문 2025년 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)