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Research on the manufacturing process and reliability for Advanced Semiconductor Packaging

Authors
김학성
Issue Date
26-Jun-2025
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/214769
Place
제주롯데호텔, 서귀포
Conference Name
2025년도 대한전자공학회 하계종합학술대회
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서울 공과대학 > 서울 기계공학부 > 2. Conference Papers

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Kim, Hak Sung
COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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