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유체 투과성을 가진 다공성 웨어러블 패치 제작 공정
- Authors
- 김동립
- Issue Date
- 27-Mar-2025
- Place
- 제주 국제컨벤션 센터(ICC)
- Conference Name
- 2025 마이크로나노시스템학회 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Dong Rip
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)