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Transient thermal analysis of multi-layer RDL for 2.1D package
- Authors
- 김동립
- Issue Date
- 8-Nov-2024
- Place
- 부산 파라다이스 호텔
- Conference Name
- ISMP 2024 (The 22nd International Symposium on Microelectronics and Packaging)
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Dong Rip
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)