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유리 인터포저 기반 이종접합 반도체 패키지의 열적 기계적 변형 및 신뢰성 분석
- Authors
- 소홍윤
- Issue Date
- 19-Jun-2025
- Place
- 부산 벡스코
- Conference Name
- 2025 한국전기전자재료학회 하계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)