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이종 접합 계면에서의 다중 스케일 열 모델링
- Authors
- 박우성
- Issue Date
- 7-Nov-2024
- Place
- 부산 파라다이스 호텔
- Conference Name
- International Symposium on Microelectronics and Packaging
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Park, Woosung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)