Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Processopen access
- Authors
- Nguyen Van Toan; Hahng, Shim; Song, Yunheub; Ono, Takahito
- Issue Date
- May-2016
- Publisher
- MDPI
- Keywords
- capacitive micromachined ultrasonic transducer; glass reflow process; anodic bonding; medical imaging; non-destructive measurement; chemical sensing
- Citation
- MICROMACHINES, v.7, no.5, pp.1 - 9
- Indexed
- SCIE
SCOPUS
- Journal Title
- MICROMACHINES
- Volume
- 7
- Number
- 5
- Start Page
- 1
- End Page
- 9
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/23116
- DOI
- 10.3390/mi7050076
- ISSN
- 2072-666X
- Abstract
- This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5 x 5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 mu m and sensing gap of 3.2 mu m (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa.
- Files in This Item
-
- Appears in
Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/23116)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.