Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
- Authors
- Oh, Yoong; Kim, Eun Jeong; Kim, Yongdeok; Choi, Kwangseok; Han, Won Bae; Kim, Hee-Soo; Yoon, Chong Seung
- Issue Date
- Feb-2016
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- ABF; Adhesion strength; Peel-off testing
- Citation
- THIN SOLID FILMS, v.600, no.2, pp.90 - 97
- Indexed
- SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 600
- Number
- 2
- Start Page
- 90
- End Page
- 97
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/23987
- DOI
- 10.1016/j.tsf.2016.01.010
- ISSN
- 0040-6090
- Abstract
- The effect of Ar plasma pretreatment on the adhesion of the sputter-deposited Cu/Ti film, which was used as a seed layer for subsequent electrodeposition of thick Cu film, on an Ajinomoto build-up film (ABF) was evaluated as a function of the plasma power. The Ar plasma pretreatment of the ABF (above 1.2 kW) surface resulted in three-fold increase of the peel-off strength (0.70 kN/m) compared to the untreated sample (0.23 kN/m). The Ar plasma treatment produced a nanoscale worm-like surface roughness on the ABF surface which was responsible for the improved adhesion of the Cu/Ti film. Examination of the fractured surfaces revealed that when the substrate was plasma-treated above 1.2 kW, the fracture occurred in the substrate rather than by delamination of the Cu/Ti film. In fact, the fracture of the ABF substrate, which consists of the SiO₂ filler embedded in a polymer resin matrix, proceeded mainly by decohesion of the SiO₂ microspheres from the polymer matrix. Hence, to further improve the adhesion of the Cu/Ti film, it is advisable to consider strengthening the interface between the SiO₂ filler and the resin matrix through surface modification of the SiO₂ microspheres.
- Files in This Item
-
Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/23987)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.