광소결 된 전극의 치밀화 향상을 위한 이종 크기의 구리 나노입자 적용에 관한 연구

Abstract

Recently, printed electronics is regarded as advanced alternatives to conventional photolithography because those are fast, low cost and eco-friendly. Printed electronics uses conductive inks containing Au or Ag nanoparticles (NPs) due to its excellent conductivity. Meanwhile, Cu NPs are regarded as an excellent alternative owing to its low cost. To utilize the Cu nano-ink, in this present work, the Cu NPs ink fabricated using two different sizes of copper nanoparticles (40 nm and 100 nm each in diameter) to investigate bimodal effect. Then, the fabricated Cu nano-inks with various mixing ratios were sintered by flash light sintering method with controlling various parameters such as irradiation energy. From these results, it was found that optimal ratio of two different size of NPs was 25:75 wt% (each 40 nm and 100 nm in diameter) which has the low resistivity of 12.6 µΩ·cm.