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An effective measurement method of electromagnetic shielding for 3D package application
- Authors
- 김영호
- Issue Date
- 24-Oct-2018
- Publisher
- Institute of Electrical and Electronics Engineers: Electronics Packaging Society - Taipei
- Citation
- 2018 International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Conference Name
- 2018 International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Place
- Taipei Nangang Exhibition Center, Taiwan
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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