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In situ monitoring of a flash light sintering process using silver nano-ink for producing flexible electronics

Authors
Chung, Wan-HoHwang, Hyun-JunLee, Seung-HyunKim, Hak-Sung
Issue Date
Jan-2013
Publisher
IOP PUBLISHING LTD
Citation
NANOTECHNOLOGY, v.24, no.3, pp.1 - 8
Indexed
SCIE
SCOPUS
Journal Title
NANOTECHNOLOGY
Volume
24
Number
3
Start Page
1
End Page
8
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/26809
DOI
10.1088/0957-4484/24/3/035202
ISSN
0957-4484
Abstract
In this work, a flash light sintering process using silver nano-inks is investigated. A silver nano-ink pattern was printed on a flexible PET (polyethylene terephthalate) substrate using a gravure-offset printing system. The printed silver nano-ink was sintered at room temperature and under ambient conditions using a flash of light from a xenon lamp using an in-house flash light sintering system. In order to monitor the light sintering process, a Wheatstone bridge electrical circuit was devised and changes in the voltage difference of the silver nano-ink were recorded during the sintering process using an oscilloscope. The sheet resistance changes during the sintering process were monitored using the in situ monitoring system devised, under various light conditions (e. g. light energy, on-time and off-time duration, and pulse numbers). The microstructure of the sintered silver film and the interface between the silver film and the PET substrate were observed using a scanning electron microscope, a focused ion beam and an optical microscope. The electrical sheet resistances of the sintered silver films were measured using a four-point probe method. Using the in situ monitoring system devised, the flash light sintering mechanism was studied for each type of light pulse (e. g. evaporation of organic binder followed by the forming of a neck-like junction and its growth, etc). The optimal flash light sintering condition is suggested on the basis of the in situ monitoring results. The optimized flash light sintering process produces a silver film with a lower sheet resistance (0: 95 Omega/sq) compared with that of the thermally sintered silver film (2: 03 Omega/sq) without damaging the PET substrate or allowing interfacial delamination between the silver film and the PET substrate.
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