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Autonomous high-speed serial link power management depending on required link performance for HMC

Authors
Jeon, D. -I.Chung, Ki Seok
Issue Date
Jul-2018
Publisher
Institute of Electrical Engineers
Keywords
power consumption; DRAM chips; power aware computing; three-dimensional integrated circuits; synchronisation; autonomous high-speed serial link power management; 3D-stacked dynamic RAMs; conventional DRAM; hybrid memory cube; 3D-stacked DRAMs; low-power modes; long mode transition times; high-speed link; active links; link performance; clock synchronisation; link power consumption reduction; low-power HMC-based system; CPU
Citation
Electronics Letters, v.54, no.15, pp 932 - 934
Pages
3
Indexed
SCI
SCIE
SCOPUS
Journal Title
Electronics Letters
Volume
54
Number
15
Start Page
932
End Page
934
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/2697
DOI
10.1049/el.2018.0997
ISSN
0013-5194
1350-911X
Abstract
Many studies on 3D-stacked dynamic RAMs (DRAMs) have been conducted to overcome the shortcomings of conventional DRAM. The hybrid memory cube (HMC) is one of the most promising 3D-stacked DRAMs, thanks to its high bandwidth and expandable structure. However, a high-speed serial link that interfaces the CPU and HMC consumes significant power, primarily because of the high overhead incurred in synchronising its clock. Although the link provides low-power modes, managing them is very difficult because of their long mode transition times. An autonomous power management method for the high-speed link is proposed. The proposed method determines the optimal number of active links while satisfying the required link performance. Simulations demonstrate that the proposed method reduces link power consumption by an average of 63.06% with a performance degradation of only 1.36%. Therefore, this proposed autonomous link power management is an outstanding option for low-power HMC-based systems.
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