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Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light

Authors
Kang, J. S.Ryu, J.Kim, H. S.Hahn, H. T.
Issue Date
Nov-2011
Publisher
SPRINGER
Keywords
Intense pulsed light; silver; nanoparticle; sintering
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.40, no.11, pp.2268 - 2277
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF ELECTRONIC MATERIALS
Volume
40
Number
11
Start Page
2268
End Page
2277
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/27672
DOI
10.1007/s11664-011-1711-0
ISSN
0361-5235
Abstract
Intense pulsed light (IPL) was used to sinter printed silver nanoink patterns consisting of 20-nm to 40-nm silver nanoparticles dispersed in diethylene glycol (DEG). Three consecutive pulses at 50 J/cm(2) in less than 30 ms was sufficient to adequately sinter silver nanoink patterns for printed electronics without degradation of the substrates. This is an exceptionally short time compared with that of the conventional thermal sintering process. On the sintered conductive silver patterns, neck-like junctions between nanoparticles were observed using scanning electron microscopy (SEM). The melting temperature, 194.1A degrees C, of silver nanoparticles was found using differential scanning calorimetry (DSC). Also, x-ray diffraction (XRD) was used to find the grain size of the printed silver nanoink patterns. The IPL-sintered silver pattern had a grain size of 86.3 +/- A 7.2 nm. From this work, it was found that the IPL-sintered silver pattern had a low resistivity of 49 +/- A 3 n Omega m, which is low enough to be used for printed electronics.
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COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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