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An Advanced Fan-out Package Utilizing Backside Metallization and Solder Self-alignment
- Authors
- 김영호
- Issue Date
- 21-Jun-2018
- Publisher
- Center for Advanced Aerospace Materials, POSTECH
- Citation
- 10 th Korea-Japan Berkeley Symposium on Advanced Materials
- Conference Name
- 10 th Korea-Japan Berkeley Symposium on Advanced Materials
- Place
- Rm 107, Graduate Institute of Ferrous Technology, POSTECH
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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