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Ion Cut-Based Thin Si Layer Transfer on the 8 inch Full Device Wafer for the Monolithic 3D Integration Scheme
- Authors
- 최창환
- Issue Date
- 6-Feb-2018
- Place
- 강원도 하이원리조트 컨벤션호텔
- Conference Name
- 한국반도체학술대회
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)