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Effect of Substrate and Damaged Layter Thickness to Residual Stress and Bow of Free-standing Gallium Nitride Wafers during Wafering Process
- Authors
- 박재근
- Issue Date
- 3-Oct-2017
- Place
- Gaylord National Resort & Convention Center
- Conference Name
- 232nd ECS Meeting
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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