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Thermo-compression flip-chip bonding technology using nonconductive adhesives for ultra-fine pitch applications
- Authors
- 김영호
- Issue Date
- 22-Jun-2017
- Publisher
- Berkeley Symposium Committee
- Citation
- 9th Korea-Japan Berkeley Symposium on Advanced Materials
- Conference Name
- 9th Korea-Japan Berkeley Symposium on Advanced Materials
- Place
- University of California, Berkeley
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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