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Microvoid Growth in the Interfaces during Aging

Authors
김영호
Issue Date
5-Dec-2016
Publisher
World Academy of Science, Engineering and Technology
Citation
18th International Conference on Electronic Packaging and Systems
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/33975
Conference Name
18th International Conference on Electronic Packaging and Systems
Place
Hong Kong, China
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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