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Moisture resistance characteristics of nanoclay reinforced adhesively bonded joint
- Authors
- 김학성
- Issue Date
- 18-Oct-2016
- Conference Name
- The 10th Asian-Australasian Conference on Composite Materials
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)