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The effect of solder wetting on nonconductive adhesive trapping in NCA applied flip-chip bonding
- Authors
- 김영호
- Issue Date
- 15-Oct-2015
- Publisher
- The Korean Microelectronics and Packaging Society
- Citation
- The 14th International Symposium on Microelectronics and Packaging
- Conference Name
- The 14th International Symposium on Microelectronics and Packaging
- Place
- KINTEX, Seoul / Ilsan, Korea
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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