Industrial 650V 4-pack super-junction MOSFET module using transfer molding process
- Authors
- Lim, Jangmuk; Seong, Jihwan; Yoon, Sang Won; Kim, You Suk; Im, Hun-Chang; Hong, Won Sik
- Issue Date
- Sep-2019
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- 4-Pack Power Module; Junction to Case Thermal Resistance; Package on-resistance; Stray Inductance; Super-Junction MOSFET; Transfer Molding
- Citation
- 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019, pp.4097 - 4101
- Indexed
- SCOPUS
- Journal Title
- 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019
- Start Page
- 4097
- End Page
- 4101
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/4527
- DOI
- 10.1109/ECCE.2019.8912910
- ISSN
- 2329-3721
- Abstract
- This paper reports a new design of a 4-pack super-junction MOSFET power module using a transfer molding process. This module initially targets industrial applications, such as photovoltaic (PV) inverters or energy storage system (ESS). Many conventional 650V power modules are gel-filled IGBT modules, but our transfer molded super-junction MOSFET power module can satisfy electrical insulation and thermal conductivity with potential reduction in production cost and module volume. Super-junction MOSFET dies are soldered on a direct bonded copper (DBC) substrate in the power module. Fabrication process is also customized to the molded super-junction MOSFET module. The designed power modules are successfully fabricated, demonstrating a volume reduction. The fabricated modules are evaluated by FEM simulations and experiments, which exhibit excellent thermal and electrical performances. A small thermal resistance (similar to 0.26 IC/W) and package on-resistance (similar to 15.7m Omega) are achieved.
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