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Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application
- Authors
- 김영호
- Issue Date
- 30-May-2013
- Publisher
- IEEE
- Citation
- Electronic Components & Technology Conference (ECTC) 2013
- Conference Name
- Electronic Components & Technology Conference (ECTC) 2013
- Place
- The Cosmopolitan of Las Vegas, Nevada, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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