Communication—Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design
- Authors
- Seo, Jihoon; Moon, Jinok; Kim, Yehwan; Kim, Kijung; Lee, Kangchun; Cho, Yoonsung; Lee, Dong-Hee; Paik, Ungyu
- Issue Date
- 2017
- Publisher
- ELECTROCHEMICAL SOC INC
- Keywords
- Chemical mechanical planarization; Experimental design; Mixed abrasive slurries; Optimization; Synergistic effect
- Citation
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.6, no.1, pp.P42 - P44
- Indexed
- SCIE
SCOPUS
- Journal Title
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
- Volume
- 6
- Number
- 1
- Start Page
- P42
- End Page
- P44
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/4844
- DOI
- 10.1149/2.0171701jss
- ISSN
- 2162-8769
- Abstract
- We have investigated the synergistic effect with mixing of three different-sized SiO2 abrasives (30 nm-SiO2, 70 nm-SiO2 and 200 nm-SiO2) and the corresponding W chemical mechanical planarization (CMP) performances. W removal rate significantly increased when the different-sized SiO2 abrasives were mixed, which is attributed to the increase in the total contact area between the abrasives and the W film. Based on the statistical model, we obtained the optimal mixing ratio (30 nm, 70 nm, 200 nm) = (0.49, 0.23, 0.28) for the highest W removal rate. These results, investigated in this study, show that the removal rate of W film can be improved via simple mixing process.
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- 서울 산업융합학부 > 서울 산업융합학부 > 1. Journal Articles
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