Highly Dispersed Fe3+-Substituted Colloidal Silica Nanoparticles for Defect-Free Tungsten Chemical Mechanical Planarization
- Authors
- Kim, Kijung; Seo, Jihoon; Lee, Myeongjae; Moon, Jinok; Lee, Kangchun; Yi, Dong Kee; Paik, Ungyu
- Issue Date
- 2017
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.6, no.7, pp.P405 - P409
- Indexed
- SCIE
SCOPUS
- Journal Title
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
- Volume
- 6
- Number
- 7
- Start Page
- P405
- End Page
- P409
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/4850
- DOI
- 10.1149/2.0171707jss
- ISSN
- 2162-8769
- Abstract
- Silica nanoparticles (NPs) are used as abrasives for tungsten chemical mechanical planarization (CMP) at acidic pH. However, the use of silica NPs at pH near their isoelectric point remains a problem because agglomeration due to low surface charge leads to defects on the tungsten surface during CMP. Herein, we report a simple strategy to increase the surface charge of silica NPs at acidic pH for defect-free tungsten CMP. The isomorphic substitution of Si4+ by Fe3+ ions on the surface of silica NPs by hydrothermal reaction led to a pH-independent permanent negative surface charge, which increased as the concentration of substituted Fe3+ ions increased. At acidic pH, the increased negative surface charge of Fe3+-substituted silica (Fe-silica) NPs resulted in a reduction in the number of agglomerated large particles relative to that of pure silica NPs. As a result, highly negatively-charged Fe-silica NPs showed high performance in the reduction of defect count on the tungsten surface after CMP.
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