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A Numerical Study for Laser-induced Thermal Cracking in Silicon Wafer
- Authors
- 장경영
- Issue Date
- 20-Jun-2012
- Place
- 제주
- Conference Name
- The 4th International Conference on Design and Analysis of Protective Structures
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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