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Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders
- Authors
- 김영호
- Issue Date
- 18-Apr-2012
- Publisher
- Institute of Electrical and Electronics Engineers
- Citation
- 12th Inyernational Conference on Electronics Packaging (ICEP)
- Conference Name
- 12th Inyernational Conference on Electronics Packaging (ICEP)
- Place
- Tokyo Big Sight, Tokyo, Japan
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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