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Effect of Pad Finish on the Reliability of Cu Bumps Fabricated Using Cu3Sn and ENIG Capping Layers for TSV Applications
- Authors
- 김영호
- Issue Date
- 17-Oct-2011
- Publisher
- The Minerals Metals & Materials Society (TMS)
- Citation
- Materials Science and Technology (MS&T) 2011
- Conference Name
- Materials Science and Technology (MS&T) 2011
- Place
- Columbus, Ohio, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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