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Effect of Solder Pad on the Fatigur Life of FBGA Memory Modules Under Harmonic Excitation by Using Global-Local Modeling Technique
- Authors
- 장건희
- Issue Date
- 26-May-2011
- Place
- Busan, Korea
- Conference Name
- K-J Symposium 2011
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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