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The Effect of Pd Thickness in the Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Their Mechanical Properties
- Authors
- 김영호
- Issue Date
- 3-Mar-2011
- Publisher
- TMS
- Citation
- TMS 2011
- Conference Name
- TMS 2011
- Place
- San Diego, CA, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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