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Vibration analysis of FBGA solder joints of the memory module subjected to harmonic excitation
- Authors
- 장건희
- Issue Date
- 13-May-2010
- Place
- 제주
- Conference Name
- 2010년 춘계학술대회논문집
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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