Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
A new Cu-Zn solder wetting layer for improved impact reliability
- Authors
- 김영호
- Issue Date
- 28-May-2009
- Publisher
- CMPT, IEEE
- Citation
- the 59th Electronic Components and Technology conference
- Conference Name
- the 59th Electronic Components and Technology conference
- Place
- San Diego, USA
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.