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Effect of Alkaline Agent with Organic Additive in Colloidal Silica Slurry on Polishing Rate Selectivity of Poly-Si to Oxide in Poly-Si CMP
- Authors
- 백운규
- Issue Date
- 20-May-2008
- Place
- Phoenix Covention Center(USA)
- Conference Name
- 213th ECS Meeting
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)